Fast PinPoint™ Mode enables high-speed nanomechanical imaging by combining sinusoidal Z modulation with continuous XY scanning. It provides quantitative measurements of properties such as modulus and adhesion with the same accuracy as standard PinPoint mode, while significantly reducing scan time across large areas.

Fast PinPoint enhances conventional force-curve-based imaging by utilizing sinusoidal Z modulation, which enables the AFM tip to cyclically contact the sample surface while the stage performs continuous XY scanning. This approach differs from the standard PinPoint mode, which uses discrete approach–hold–retract steps at each pixel.

By acquiring force–distance (F/d) curves at each sinusoidal contact point, Fast PinPoint enables accurate real-time acquisition of nanomechanical properties, including Young’s modulus and adhesion force, with the same quantitative precision as standard PinPoint. The key advantage lies in its ability to scan larger areas significantly faster while minimizing lateral forces and preserving tip integrity.

Developing Fast PinPoint required overcoming key challenges in high-speed, force-curve-based AFM imaging. The primary issue was maintaining stable tip–sample contact during kilohertz-frequency sinusoidal Z modulation, which can easily cause signal instability or loss of contact. Park Systems addressed this by optimizing Z servo control for smooth high-frequency motion and by ensuring tight synchronization with XY scanning, preserving spatial accuracy at high speed.

Another challenge was ensuring quantitative accuracy for modulus and adhesion under fast scanning conditions. This was achieved through refined calibration routines—including force slope, spring constant, and deflection sensitivity—allowing Fast PinPoint to deliver the same precision as standard PinPoint mode, even on soft or heterogeneous samples.

Fast PinPoint reduces nanomechanical imaging time by a factor of up to 8 compared to standard force-mapping modes, while delivering the same level of accuracy and spatial resolution in modulus and adhesion measurements.